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Sensors (Basel, Switzerland)|January 25, 2025
Influence of Initial Gap, Voltage, and Additives on Zinc Microcolumn Morphology by Local Electrochemical DepositionYi Liu, Fuliang WangScientific Reports|June 9, 2021
Experiment and simulation of single inhibitor SH110 for void-free TSV copper fillingFuliang Wang, Yuping LeThe Journal of Chemical Physics|November 17, 2025
Effects of geometric parameters and wettability on pattern collapse in nanoscale systemsYang Wang, Fuliang WangSensors (Basel, Switzerland)|March 13, 2024
CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved SensitivityWenhao Yao, Hu He, Fuliang WangScientific Reports|May 18, 2016
Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columnsFuliang Wang, Hongbin Xiao, Hu HeScientific Reports|February 18, 2016
Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronicsFuliang Wang, Peng Mao, Hu HeOptics Express|October 15, 2022
Self-healing property of the self-rotating beamKai Niu, Yongping Zhai, Fuliang WangScientific Reports|April 20, 2017
Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densitiesFuliang Wang, Zhipeng Zhao, Nantian Nie, et al.Nanomaterials (Basel, Switzerland)|April 25, 2019
Graphene/Glycerin Solution-Based Multifunctional Stretchable Strain Sensor with Ultra-High Stretchability, Stability, and SensitivityZhenkun Qi, Hailiang Bian, Yi Yang, et al.Optics Express|February 25, 2022
Self-rotating beam in the free space propagationKai Niu, Shangdong Zhao, Yu Liu, et al.Pageof 2