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Materials (Basel, Switzerland)|August 28, 2025
Composition-Dependent Creep Resistance and Strain Rate Sensitivity of BCC Mg-Sc Alloy Studied via Nano-Indentation on Diffusion CoupleChenyue Liu, Guanglong Xu, Fuwen ChenMaterials (Basel, Switzerland)|September 5, 2019
Optimization of Low-Cost Ti-35421 Titanium Alloy: Phase Transformation, Bimodal Microstructure, and Combinatorial Mechanical PropertiesFuwen Chen, Guanglong Xu, Yuwen Cui, et al.Materials (Basel, Switzerland)|August 14, 2025
High-Throughput Study on Nanoindentation Deformation of Al-Mg-Si AlloysTong Shen, Guanglong Xu, Fuwen Chen, et al.Physical Chemistry Chemical Physics : PCCP|July 8, 2016
The formation mechanism of eutectic microstructures in NiAl-Cr compositesBin Tang, Daniel A Cogswell, Guanglong Xu, et al.Materials (Basel, Switzerland)|April 13, 2024
Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper DepositionZihong Gao, Chengli Zhang, Qiang Wang, et al.BMC Medical Genomics|April 28, 2023
Apoptosis related genes mediated molecular subtypes depict the hallmarks of the tumor microenvironment and guide immunotherapy in bladder cancerLiquan Zhou, Guanglong Xu, Fu Huang, et al.ACS Applied Materials & Interfaces|December 19, 2023
Improved Electrical Resistivity of Atomic-Layer-Deposited Copper Thin Films on Polyimide Substrates by an In Situ ZnO InterlayerZihong Gao, Chengli Zhang, Qiang Wang, et al.Materials (Basel, Switzerland)|October 10, 2018
Diffusivities and Atomic Mobilities in bcc Ti-Mo-Zr AlloysWeimin Bai, Guanglong Xu, Mingyue Tan, et al.Materials (Basel, Switzerland)|June 26, 2026
Optimized Interfacial Layers for High-Adhesion and Damp-Heat-Resistant Cu Meshes with Aperiodic Geometries on PET SubstratesXiao Lu, Jia Li, Biyou Bao, et al.ACS Applied Materials & Interfaces|March 25, 2024
Homogeneous and Nanogranular Prussian Blue to Enable Long-Term-Stable Electrochromic DevicesXiaofang Fu, Kun Li, Chengli Zhang, et al.Pageof 1