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Polymers|February 27, 2026
Development of Suberinic Acids-Bonded Medium-Density ParticleboardRamunas Tupciauskas, Andris Berzins, Gunars Pavlovics, et al.
Materials (Basel, Switzerland)|May 27, 2023
Optimization of Thermal Conductivity vs. Bulk Density of Steam-Exploded Loose-Fill Annual LignocellulosicsRamunas Tupciauskas, Andris Berzins, Gunars Pavlovics, et al.
Polymers|February 24, 2024
Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and ReedRamunas Tupciauskas, Zigmunds Orlovskis, Karlis Trevors Blums, et al.
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