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Optics Express|August 9, 2017
Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical combJaeseok Bae, Jungjae Park, Heulbi Ahn, et al.Optics Express|October 7, 2021
Optical method for simultaneous thickness measurements of two layers with a significant thickness differenceJaeseok Bae, Jungjae Park, Heulbi Ahn, et al.Scientific Reports|October 28, 2018
A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart DevicesHeulbi Ahn, Jaeseok Bae, Jungjae Park, et al.Pageof 1