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Micromachines|November 27, 2024
3D-Printed Multi-Axis Alignment Airgap Dielectric Layer for Flexible Capacitive Pressure SensorJeong-Beom Ko, Soo-Wan Kim, Hyeon-Beom Kim, et al.
Small (Weinheim an Der Bergstrasse, Germany)|September 2, 2024
Exploring Doping Mechanisms and Modulating Carrier Concentration in Copper Iodide: Applications in Thermoelectric MaterialsGa Hye Kim, Hyeon-Beom Kim, Hyungseok Lee, et al.
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