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J W Xian

Showing results (1-10 of 4) with videos related to

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Journal of Materials Science|May 11, 2026
Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder jointsC L Hsieh, R J Coyle, J W Xian, et al.
Journal of Materials Science. Materials in Electronics|October 27, 2025
Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cyclingC L Hsieh, R J Coyle, S A Belyakov, et al.
Nature Communications|May 20, 2024
The role of microstructure in the thermal fatigue of solder jointsJ W Xian, Y L Xu, S Stoyanov, et al.
Scientific Reports|January 13, 2017
In situ imaging of microstructure formation in electronic interconnectionsM A A Mohd Salleh, C M Gourlay, J W Xian, et al.
Pageof 1

Showing results (1-10 of 4) with videos related to

Sort By:
Pageof 1
Journal of Materials Science|May 11, 2026
Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder jointsC L Hsieh, R J Coyle, J W Xian, et al.
Journal of Materials Science. Materials in Electronics|October 27, 2025
Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cyclingC L Hsieh, R J Coyle, S A Belyakov, et al.
Nature Communications|May 20, 2024
The role of microstructure in the thermal fatigue of solder jointsJ W Xian, Y L Xu, S Stoyanov, et al.
Scientific Reports|January 13, 2017
In situ imaging of microstructure formation in electronic interconnectionsM A A Mohd Salleh, C M Gourlay, J W Xian, et al.
Pageof 1