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Jan Reboun

Showing results (1-10 of 4) with videos related to

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Materials (Basel, Switzerland)|November 27, 2021
Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics ApplicationsJiri Hlina, Jan Reboun, Ales Hamacek
Materials (Basel, Switzerland)|December 11, 2022
Study of Internal Stress in Conductive and Dielectric Thick FilmsJiri Hlina, Jan Reboun, Martin Janda, et al.
Scientific Reports|November 11, 2025
Comparative analysis of printed electronics technologies in RF and microwave circuitsSaeedeh Lotfi, Martin Janda, Jan Reboun, et al.
Materials (Basel, Switzerland)|February 25, 2022
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed CopperJiri Hlina, Jan Reboun, Marek Simonovsky, et al.
Pageof 1

Showing results (1-10 of 4) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|November 27, 2021
Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics ApplicationsJiri Hlina, Jan Reboun, Ales Hamacek
Materials (Basel, Switzerland)|December 11, 2022
Study of Internal Stress in Conductive and Dielectric Thick FilmsJiri Hlina, Jan Reboun, Martin Janda, et al.
Scientific Reports|November 11, 2025
Comparative analysis of printed electronics technologies in RF and microwave circuitsSaeedeh Lotfi, Martin Janda, Jan Reboun, et al.
Materials (Basel, Switzerland)|February 25, 2022
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed CopperJiri Hlina, Jan Reboun, Marek Simonovsky, et al.
Pageof 1