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Nanomaterials (Basel, Switzerland)
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July 2, 2021
Electrical Interconnection and Bonding by Nano-Locking
Jielin Guo, Yu-Chou Shih, Frank G Shi
Nanomaterials (Basel, Switzerland)
|
August 27, 2021
Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness
Jielin Guo, Yu-Chou Shih, Roozbeh Sheikhi, et al.
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of 1
Search research articles
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Showing results (1-10 of 2) with videos related to
Sort By:
Page
of 1
Nanomaterials (Basel, Switzerland)
|
July 2, 2021
Electrical Interconnection and Bonding by Nano-Locking
Jielin Guo, Yu-Chou Shih, Frank G Shi
Nanomaterials (Basel, Switzerland)
|
August 27, 2021
Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness
Jielin Guo, Yu-Chou Shih, Roozbeh Sheikhi, et al.
Page
of 1