Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Filters

Jiuchun Yan

Showing results (1-10 of 23) with videos related to

Pageof 3
Sort By:
Scientific Reports|November 17, 2018
Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasoundsBingzhi Wu, Xuesong Leng, Ziyang Xiu, et al.
Ultrasonics Sonochemistry|June 22, 2017
Stability of cavitation structures in a thin liquid layerPengfei Wu, Lixin Bai, Weijun Lin, et al.
Ultrasonics Sonochemistry|April 15, 2011
Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti6Al4V and Al4Cu1MgZhipeng Ma, Weiwei Zhao, Jiuchun Yan, et al.
Ultrasonics Sonochemistry|September 27, 2017
Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°CWeibing Guo, Tianmin Luan, Jingshan He, et al.
Ultrasonics Sonochemistry|April 23, 2018
Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasoundBingzhi Wu, Xuesong Leng, Ziyang Xiu, et al.
Ultrasonics Sonochemistry|June 3, 2014
Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasoundWei Cui, Jiuchun Yan, Yan Dai, et al.
Ultrasonics Sonochemistry|April 8, 2020
Cavitation in thin liquid layer: A reviewLixin Bai, Jiuchun Yan, Zhijie Zeng, et al.
Ultrasonics|December 4, 2013
Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder dropletsLin Ma, Zhiwu Xu, Kun Zheng, et al.
Ultrasonics Sonochemistry|August 30, 2012
Wetting and reaction promoted by ultrasound between sapphire and liquid Al-12Si alloyWei Cui, Changwen Wang, Jiuchun Yan, et al.
Ultrasonics Sonochemistry|May 10, 2018
Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to AlZhiwu Xu, Zhengwei Li, Jiaqi Li, et al.
Pageof 3

Showing results (1-10 of 23) with videos related to

Sort By:
Pageof 3
Scientific Reports|November 17, 2018
Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasoundsBingzhi Wu, Xuesong Leng, Ziyang Xiu, et al.
Ultrasonics Sonochemistry|June 22, 2017
Stability of cavitation structures in a thin liquid layerPengfei Wu, Lixin Bai, Weijun Lin, et al.
Ultrasonics Sonochemistry|April 15, 2011
Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti6Al4V and Al4Cu1MgZhipeng Ma, Weiwei Zhao, Jiuchun Yan, et al.
Ultrasonics Sonochemistry|September 27, 2017
Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°CWeibing Guo, Tianmin Luan, Jingshan He, et al.
Ultrasonics Sonochemistry|April 23, 2018
Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasoundBingzhi Wu, Xuesong Leng, Ziyang Xiu, et al.
Ultrasonics Sonochemistry|June 3, 2014
Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasoundWei Cui, Jiuchun Yan, Yan Dai, et al.
Ultrasonics Sonochemistry|April 8, 2020
Cavitation in thin liquid layer: A reviewLixin Bai, Jiuchun Yan, Zhijie Zeng, et al.
Ultrasonics|December 4, 2013
Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder dropletsLin Ma, Zhiwu Xu, Kun Zheng, et al.
Ultrasonics Sonochemistry|August 30, 2012
Wetting and reaction promoted by ultrasound between sapphire and liquid Al-12Si alloyWei Cui, Changwen Wang, Jiuchun Yan, et al.
Ultrasonics Sonochemistry|May 10, 2018
Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to AlZhiwu Xu, Zhengwei Li, Jiaqi Li, et al.
Pageof 3