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Micromachines|July 29, 2023
Surface Modification of Silicon Carbide Wafers Using Atmospheric Plasma Etching: Effects of Processing ParametersQi Jin, Julong Yuan, Jianxing Zhou
Materials (Basel, Switzerland)|April 13, 2023
Multidimensional Study on the Wear of High-Speed, High-Temperature, Heavy-Load BearingsDongfeng Wang, Julong Yuan, Lai Hu, et al.
Micromachines|July 8, 2023
Experimental Study on Shear Rheological Polishing of Si Surface of 4H-SiC WaferPeng Li, Julong Yuan, Minghui Zhu, et al.
Micromachines|October 29, 2025
Simulation and Experimental Study on Abrasive-Tool Interaction in Drag Finishing Edge PreparationJulong Yuan, Yuhong Yan, Youzhi Fu, et al.
Micromachines|May 27, 2023
Study of Atmospheric Pressure Plasma Temperature Based on Silicon Carbide EtchingShaozhen Xu, Julong Yuan, Jianxing Zhou, et al.
Micromachines|April 23, 2022
Effect of Wetting Characteristics of Polishing Fluid on the Quality of Water-Dissolution Polishing of KDP CrystalsXu Wang, Hang Gao, Qianfa Deng, et al.
Materials (Basel, Switzerland)|June 10, 2022
Investigation on the Basic Characteristics of Semi-Fixed Abrasive Grains Polishing Technique for Polishing Sapphire (α-Al2O3)Yang Lei, Ming Feng, Ke Wu, et al.
Micromachines|August 27, 2021
Shear Thickening Polishing of Quartz GlassQi Shao, Shixiang Duan, Lin Fu, et al.
Micromachines|May 31, 2020
Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon WaferTianchen Zhao, Qianfa Deng, Cheng Zhang, et al.
Micromachines|August 13, 2020
The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire WaferZhixiang Chen, Linlin Cao, Julong Yuan, et al.
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