Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Filters

Kai-Cheng Shie

Showing results (1-10 of 9) with videos related to

Pageof 1
Sort By:
Materials (Basel, Switzerland)|November 13, 2021
Effect of Bonding Strength on Electromigration Failure in Cu-Cu BumpsKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|October 13, 2021
Failure Mechanisms of Cu-Cu Bumps under Thermal CyclingKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|July 27, 2022
Failures of Cu-Cu Joints under Temperature Cycling TestsPo-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, et al.
Materials (Basel, Switzerland)|October 27, 2022
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder JointsPo-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, et al.
Nanomaterials (Basel, Switzerland)|February 25, 2023
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during AnnealingJyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, et al.
Scientific Reports|July 30, 2022
Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu-Cu jointsJia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, et al.
Nanomaterials (Basel, Switzerland)|May 13, 2023
High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface ActivationPin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, et al.
Materials (Basel, Switzerland)|March 10, 2022
Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu SurfacesJia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, et al.
Scientific Reports|April 26, 2022
Artificial intelligence deep learning for 3D IC reliability predictionPo-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, et al.
Pageof 1

Showing results (1-10 of 9) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|November 13, 2021
Effect of Bonding Strength on Electromigration Failure in Cu-Cu BumpsKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|October 13, 2021
Failure Mechanisms of Cu-Cu Bumps under Thermal CyclingKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|July 27, 2022
Failures of Cu-Cu Joints under Temperature Cycling TestsPo-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, et al.
Materials (Basel, Switzerland)|October 27, 2022
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder JointsPo-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, et al.
Nanomaterials (Basel, Switzerland)|February 25, 2023
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during AnnealingJyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, et al.
Scientific Reports|July 30, 2022
Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu-Cu jointsJia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, et al.
Nanomaterials (Basel, Switzerland)|May 13, 2023
High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface ActivationPin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, et al.
Materials (Basel, Switzerland)|March 10, 2022
Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu SurfacesJia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, et al.
Scientific Reports|April 26, 2022
Artificial intelligence deep learning for 3D IC reliability predictionPo-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, et al.
Pageof 1