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Materials (Basel, Switzerland)|August 12, 2018
Ga-Based Alloys in Microelectronic Interconnects: A ReviewShiqian Liu, Keith Sweatman, Stuart McDonald, et al.Materials (Basel, Switzerland)|August 28, 2025
In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron MicroscopyKazuhiro Nogita, Xin Fu Tan, Jiye Zhou, et al.Pageof 1