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Clinical and Experimental Reproductive Medicine|November 2, 2013
Comparison of the clinical outcomes of day 4 and 5 embryo transfer cyclesSun-Hee Lee, Hyoung-Song Lee, Chun Kyu Lim, et al.Paediatric Anaesthesia|January 6, 2015
Propofol-ketamine or propofol-remifentanil for deep sedation and analgesia in pediatric patients undergoing burn dressing changes: a randomized clinical trialTai-Kyung Seol, Jin-Kyu Lim, Eun-Kyung Yoo, et al.Journal of Nanoscience and Nanotechnology|January 6, 2021
Influence of Si Content on Tensile Properties and Fractography of Al-Mg-Si Ternary AlloysShah Abdul Wahid, Seong-Ho Ha, Bong-Hwan Kim, et al.Journal of Nanoscience and Nanotechnology|November 25, 2018
Surface Enrichment of Mg and Ca in Cu-Mg Alloy Containing a Trace Amount of Ca and Its Effects on Oxidation ResistanceSeong-Ho Ha, Bong-Hwan Kim, Young-Ok Yoon, et al.Journal of Microbiology and Biotechnology|April 5, 2008
Expression and characterization of polyketide synthase module involved in the late step of cephabacin biosynthesis from Lysobacter lactamgenusJi Seon Lee, Miglena G Vladimirova, Atanas V Demirev, et al.Fertility and Sterility|December 14, 2007
A healthy live birth after successful preimplantation genetic diagnosis for carriers of complex chromosome rearrangementsChun Kyu Lim, Jae Won Cho, Jin Yeong Kim, et al.Biochemical and Biophysical Research Communications|November 21, 2024
Redefining copy number variation and single-nucleotide polymorphism counting via novel concepts based on recent PCR enhancementsJae Jong Kim, Hyoung-Min Park, A Young Kyoung, et al.Journal of Neuroimmunology|July 17, 2003
Activation of mitogen-activated protein kinases in experimental autoimmune encephalomyelitisTaekyun Shin, Meejung Ahn, Kyungsook Jung, et al.Korean Journal of Orthodontics|October 14, 2014
The relation between idiopathic scoliosis and the frontal and lateral facial formTae-Hwan Kim, Joo-Hwan Kim, Yae-Jin Kim, et al.Journal of Nanoscience and Nanotechnology|May 15, 2015
Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technologyTae-Yoo Kim, Hwa-Jin Son, Seung-Kyu Lim, et al.Pageof 46