Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Filters

Lanfeng Guo

Showing results (1-10 of 5) with videos related to

Pageof 1
Sort By:
ACS Omega|December 18, 2023
Role of Additives: Modified Hemihydrate Phosphogypsum Morphology and Enhanced Filtration Performance of Wet-Process Phosphoric AcidXuejian Huo, Lanfeng Guo, Renlong Liu, et al.
ACS Omega|April 1, 2024
Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and ApplicationsLanfeng Guo, Renlong Liu, Zhaobo He, et al.
ACS Omega|December 11, 2023
Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer ElectroplatingHu Wei, Tong Tan, Renlong Liu, et al.
ACS Omega|May 20, 2024
Electroplated Copper Additives for Advanced Packaging: A ReviewLanfeng Guo, Shaoping Li, Zhaobo He, et al.
Materials (Basel, Switzerland)|April 24, 2025
Investigation of 2-Mercapto-1-Methylimidazole as a New Type of Leveler in Wafer Electroplating CopperTong Tan, Renlong Liu, Lanfeng Guo, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
ACS Omega|December 18, 2023
Role of Additives: Modified Hemihydrate Phosphogypsum Morphology and Enhanced Filtration Performance of Wet-Process Phosphoric AcidXuejian Huo, Lanfeng Guo, Renlong Liu, et al.
ACS Omega|April 1, 2024
Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and ApplicationsLanfeng Guo, Renlong Liu, Zhaobo He, et al.
ACS Omega|December 11, 2023
Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer ElectroplatingHu Wei, Tong Tan, Renlong Liu, et al.
ACS Omega|May 20, 2024
Electroplated Copper Additives for Advanced Packaging: A ReviewLanfeng Guo, Shaoping Li, Zhaobo He, et al.
Materials (Basel, Switzerland)|April 24, 2025
Investigation of 2-Mercapto-1-Methylimidazole as a New Type of Leveler in Wafer Electroplating CopperTong Tan, Renlong Liu, Lanfeng Guo, et al.
Pageof 1