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Biomedical Microdevices
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February 6, 2015
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, et al.
IEEE Transactions on Biomedical Circuits and Systems
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January 11, 2015
2.5D heterogeneously integrated microsystem for high-density neural sensing applications
Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, et al.
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of 4
Search research articles
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Showing results (31-40 of 32) with videos related to
Sort By:
Page
of 4
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This site can display upto 32 results.
Biomedical Microdevices
|
February 6, 2015
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, et al.
IEEE Transactions on Biomedical Circuits and Systems
|
January 11, 2015
2.5D heterogeneously integrated microsystem for high-density neural sensing applications
Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, et al.
Page
of 4