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Biomedical Microdevices|February 6, 2015
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applicationsChih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, et al.
IEEE Transactions on Biomedical Circuits and Systems|January 11, 2015
2.5D heterogeneously integrated microsystem for high-density neural sensing applicationsPo-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, et al.
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