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Marianna Maiaru

Showing results (1-10 of 5) with videos related to

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Polymer Journal|May 9, 2025
High-performance, multi-component epoxy resin simulation for predicting thermo-mechanical property evolution during curingSagar Umesh Patil, Josh Kemppainen, Marianna Maiaru, et al.
The Journal of Physical Chemistry. C, Nanomaterials and Interfaces|September 26, 2024
Evolution of Physical, Thermal, and Mechanical Properties of Poly(methyl Methacrylate)-Based Elium Thermoplastic Polymer During PolymerizationSwapnil S Bamane, Prathamesh P Deshpande, Sagar U Patil, et al.
Soft Matter|August 25, 2023
Simple and convenient mapping of molecular dynamics mechanical property predictions of bisphenol-F epoxy for strain rate, temperature, and degree of cureSagar U Patil, Aaron S Krieg, Leif K Odegard, et al.
ACS Applied Engineering Materials|December 1, 2023
Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical PropertiesKhatereh Kashmari, Hashim Al Mahmud, Sagar U Patil, et al.
Soft Matter|September 23, 2022
Accurate predictions of thermoset resin glass transition temperatures from all-atom molecular dynamics simulationGregory M Odegard, Sagar U Patil, Prashik S Gaikwad, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
Polymer Journal|May 9, 2025
High-performance, multi-component epoxy resin simulation for predicting thermo-mechanical property evolution during curingSagar Umesh Patil, Josh Kemppainen, Marianna Maiaru, et al.
The Journal of Physical Chemistry. C, Nanomaterials and Interfaces|September 26, 2024
Evolution of Physical, Thermal, and Mechanical Properties of Poly(methyl Methacrylate)-Based Elium Thermoplastic Polymer During PolymerizationSwapnil S Bamane, Prathamesh P Deshpande, Sagar U Patil, et al.
Soft Matter|August 25, 2023
Simple and convenient mapping of molecular dynamics mechanical property predictions of bisphenol-F epoxy for strain rate, temperature, and degree of cureSagar U Patil, Aaron S Krieg, Leif K Odegard, et al.
ACS Applied Engineering Materials|December 1, 2023
Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical PropertiesKhatereh Kashmari, Hashim Al Mahmud, Sagar U Patil, et al.
Soft Matter|September 23, 2022
Accurate predictions of thermoset resin glass transition temperatures from all-atom molecular dynamics simulationGregory M Odegard, Sagar U Patil, Prashik S Gaikwad, et al.
Pageof 1