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Marios Gourdouparis

Showing results (1-10 of 3) with videos related to

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IEEE Transactions on Biomedical Circuits and Systems|March 4, 2024
A Spatially Diverse 2TX-3RX Galvanic-Coupled Transdural Telemetry for Tether-Less Distributed Brain-Computer InterfacesChengyao Shi, Yuming He, Marios Gourdouparis, et al.
Sensors (Basel, Switzerland)|April 28, 2023
A Low-Power Analog Integrated Implementation of the Support Vector Machine Algorithm with On-Chip Learning Tested on a Bearing Fault ApplicationVassilis Alimisis, Georgios Gennis, Marios Gourdouparis, et al.
IEEE Transactions on Biomedical Circuits and Systems|March 18, 2024
An Event-Based Neural Compressive Telemetry With >11× Loss-Less Data Reduction for High-Bandwidth Intracortical Brain Computer InterfacesYuming He, Stan van der Ven, Hua-Peng Liaw, et al.
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Showing results (1-10 of 3) with videos related to

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Pageof 1
IEEE Transactions on Biomedical Circuits and Systems|March 4, 2024
A Spatially Diverse 2TX-3RX Galvanic-Coupled Transdural Telemetry for Tether-Less Distributed Brain-Computer InterfacesChengyao Shi, Yuming He, Marios Gourdouparis, et al.
Sensors (Basel, Switzerland)|April 28, 2023
A Low-Power Analog Integrated Implementation of the Support Vector Machine Algorithm with On-Chip Learning Tested on a Bearing Fault ApplicationVassilis Alimisis, Georgios Gennis, Marios Gourdouparis, et al.
IEEE Transactions on Biomedical Circuits and Systems|March 18, 2024
An Event-Based Neural Compressive Telemetry With >11× Loss-Less Data Reduction for High-Bandwidth Intracortical Brain Computer InterfacesYuming He, Stan van der Ven, Hua-Peng Liaw, et al.
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