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Micromachines|April 3, 2021
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded WaferSeyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi, et al.
Micromachines|January 21, 2023
An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer BondingSeyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi, et al.
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