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Micromachines|February 25, 2023
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible SubstratesFranz Selbmann, Soumya Deep Paul, Maulik Satwara, et al.Micromachines|August 26, 2022
Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized CoilsChristian Hofmann, Maulik Satwara, Martin Kroll, et al.Pageof 1