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Nanotechnology
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March 17, 2023
Deep reactive ion etching of cylindrical nanopores in silicon for photonic crystals
Melissa J Goodwin, Cornelis A M Harteveld, Meint J de Boer, et al.
Micromachines
|
November 11, 2022
Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD
Henk-Willem Veltkamp, Yves L Janssens, Meint J de Boer, et al.
Nano Letters
|
August 14, 2008
Nanoimprint lithography for nanophotonics in silicon
Christiaan M Bruinink, Matteo Burresi, Meint J de Boer, et al.
Optics Letters
|
April 12, 2011
Micromechanically tuned ring resonator in silicon on insulator
Lasse J Kauppinen, Shahina M C Abdulla, Meindert Dijkstra, et al.
Micromachines
|
June 4, 2020
Heavily-Doped Bulk Silicon Sidewall Electrodes Embedded between Free-Hanging Microfluidic Channels by Modified Surface Channel Technology
Yiyuan Zhao, Henk-Willem Veltkamp, Thomas V P Schut, et al.
Microsystems & Nanoengineering
|
September 27, 2021
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography
Shu Ni, Erwin J W Berenschot, Pieter J Westerik, et al.
Page
of 1
Search research articles
Search
Showing results (1-10 of 6) with videos related to
Sort By:
Page
of 1
Nanotechnology
|
March 17, 2023
Deep reactive ion etching of cylindrical nanopores in silicon for photonic crystals
Melissa J Goodwin, Cornelis A M Harteveld, Meint J de Boer, et al.
Micromachines
|
November 11, 2022
Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD
Henk-Willem Veltkamp, Yves L Janssens, Meint J de Boer, et al.
Nano Letters
|
August 14, 2008
Nanoimprint lithography for nanophotonics in silicon
Christiaan M Bruinink, Matteo Burresi, Meint J de Boer, et al.
Optics Letters
|
April 12, 2011
Micromechanically tuned ring resonator in silicon on insulator
Lasse J Kauppinen, Shahina M C Abdulla, Meindert Dijkstra, et al.
Micromachines
|
June 4, 2020
Heavily-Doped Bulk Silicon Sidewall Electrodes Embedded between Free-Hanging Microfluidic Channels by Modified Surface Channel Technology
Yiyuan Zhao, Henk-Willem Veltkamp, Thomas V P Schut, et al.
Microsystems & Nanoengineering
|
September 27, 2021
Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography
Shu Ni, Erwin J W Berenschot, Pieter J Westerik, et al.
Page
of 1