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Philosophical Transactions. Series A, Mathematical, Physical, and Engineering Sciences|February 15, 2008
Porous low dielectric constant materials for microelectronicsMikhail R Baklanov, Karen MaexMaterials (Basel, Switzerland)|April 30, 2021
Analytical Study of Porous Organosilicate Glass Films Prepared from Mixtures of 1,3,5- and 1,3-AlkoxysilylbenzenesMd Rasadujjaman, Xuesong Wang, Yanrong Wang, et al.Langmuir : the ACS Journal of Surfaces and Colloids|September 17, 2013
Effect of pore structure of nanometer scale porous films on the measured elastic modulusKris Vanstreels, Chen Wu, Mario Gonzalez, et al.Nature Communications|January 27, 2011
Pseudogap in a thin film of a conventional superconductorBenjamin Sacépé, Claude Chapelier, Tatyana I Baturina, et al.Scientific Reports|May 13, 2017
Reentrant Resistive Behavior and Dimensional Crossover in Disordered Superconducting TiN FilmsSvetlana V Postolova, Alexey Yu Mironov, Mikhail R Baklanov, et al.Data in Brief|March 15, 2021
Effect of methyl terminal and ethylene bridging groups on porous organosilicate glass films: FTIR, ellipsometric porosimetry, luminescence datasetMd Rasadujjaman, Jinming Zhang, Konstantin P Mogilnikov, et al.Chemical Communications (Cambridge, England)|January 31, 2012
A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomersFrederik Goethals, Mikhail R Baklanov, Ivan Ciofi, et al.Langmuir : the ACS Journal of Surfaces and Colloids|October 3, 2009
Unusual modification of CuCl or CuBr films by He plasma exposure resulting in nanowire formationDries Dictus, Mikhail R Baklanov, Vitaly Pikulev, et al.Langmuir : the ACS Journal of Surfaces and Colloids|March 14, 2014
Impact of plasma pretreatment and pore size on the sealing of ultra-low-k dielectrics by self-assembled monolayersYiting Sun, Mikhail Krishtab, Herbert Struyf, et al.Nature|April 4, 2008
Superinsulator and quantum synchronizationValerii M Vinokur, Tatyana I Baturina, Mikhail V Fistul, et al.Pageof 3