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Nadine Gergel

Showing results (1-10 of 5) with videos related to

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Organic Letters|January 27, 2006
First optically active molecular electronic wiresYuliang Zhu, Nadine Gergel, Nabanita Majumdar, et al.
Journal of the American Chemical Society|March 8, 2008
Demonstration of molecular assembly on Si (100) for CMOS-compatible molecule-based electronic devicesNadine Gergel-Hackett, Christopher D Zangmeister, Christina A Hacker, et al.
Nano Letters|January 15, 2008
Probing molecules in integrated silicon-molecule-metal junctions by inelastic tunneling spectroscopyWenyong Wang, Adina Scott, Nadine Gergel-Hackett, et al.
Journal of Physics. Condensed Matter : an Institute of Physics Journal|June 23, 2011
Molecule-induced interface states dominate charge transport in Si-alkyl-metal junctionsLam H Yu, Nadine Gergel-Hackett, Christopher D Zangmeister, et al.
Journal of the American Chemical Society|August 13, 2009
Formation of silicon-based molecular electronic structures using flip-chip laminationMariona Coll, Lauren H Miller, Lee J Richter, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
Organic Letters|January 27, 2006
First optically active molecular electronic wiresYuliang Zhu, Nadine Gergel, Nabanita Majumdar, et al.
Journal of the American Chemical Society|March 8, 2008
Demonstration of molecular assembly on Si (100) for CMOS-compatible molecule-based electronic devicesNadine Gergel-Hackett, Christopher D Zangmeister, Christina A Hacker, et al.
Nano Letters|January 15, 2008
Probing molecules in integrated silicon-molecule-metal junctions by inelastic tunneling spectroscopyWenyong Wang, Adina Scott, Nadine Gergel-Hackett, et al.
Journal of Physics. Condensed Matter : an Institute of Physics Journal|June 23, 2011
Molecule-induced interface states dominate charge transport in Si-alkyl-metal junctionsLam H Yu, Nadine Gergel-Hackett, Christopher D Zangmeister, et al.
Journal of the American Chemical Society|August 13, 2009
Formation of silicon-based molecular electronic structures using flip-chip laminationMariona Coll, Lauren H Miller, Lee J Richter, et al.
Pageof 1