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Materials (Basel, Switzerland)|March 10, 2022
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu SurfacesJia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, et al.
Scientific Reports|April 26, 2022
Artificial intelligence deep learning for 3D IC reliability predictionPo-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, et al.
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