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Po-Ning Hsu

Showing results (1-10 of 7) with videos related to

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Materials (Basel, Switzerland)|October 13, 2021
Failure Mechanisms of Cu-Cu Bumps under Thermal CyclingKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|July 27, 2022
Failures of Cu-Cu Joints under Temperature Cycling TestsPo-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, et al.
Materials (Basel, Switzerland)|November 13, 2021
Effect of Bonding Strength on Electromigration Failure in Cu-Cu BumpsKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|October 27, 2022
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder JointsPo-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, et al.
Scientific Reports|July 30, 2022
Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu-Cu jointsJia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, et al.
Scientific Reports|September 19, 2018
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambientJing-Ye Juang, Chia-Ling Lu, Kuan-Ju Chen, et al.
Scientific Reports|April 26, 2022
Artificial intelligence deep learning for 3D IC reliability predictionPo-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, et al.
Pageof 1

Showing results (1-10 of 7) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|October 13, 2021
Failure Mechanisms of Cu-Cu Bumps under Thermal CyclingKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|July 27, 2022
Failures of Cu-Cu Joints under Temperature Cycling TestsPo-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, et al.
Materials (Basel, Switzerland)|November 13, 2021
Effect of Bonding Strength on Electromigration Failure in Cu-Cu BumpsKai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, et al.
Materials (Basel, Switzerland)|October 27, 2022
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder JointsPo-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, et al.
Scientific Reports|July 30, 2022
Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu-Cu jointsJia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, et al.
Scientific Reports|September 19, 2018
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambientJing-Ye Juang, Chia-Ling Lu, Kuan-Ju Chen, et al.
Scientific Reports|April 26, 2022
Artificial intelligence deep learning for 3D IC reliability predictionPo-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, et al.
Pageof 1