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Advanced Materials (Deerfield Beach, Fla.)
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November 9, 2023
Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study
Simon Johannes Gräfner, Jeng-Hau Huang, Po-Yi Wu, et al.
Materials (Basel, Switzerland)
|
April 13, 2024
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, et al.
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Search research articles
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Showing results (1-10 of 2) with videos related to
Sort By:
Page
of 1
Advanced Materials (Deerfield Beach, Fla.)
|
November 9, 2023
Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study
Simon Johannes Gräfner, Jeng-Hau Huang, Po-Yi Wu, et al.
Materials (Basel, Switzerland)
|
April 13, 2024
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, et al.
Page
of 1