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Qiushi Kang

Showing results (1-10 of 7) with videos related to

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Lab on a Chip|May 22, 2023
Room-temperature bonding of glass chips <i>via</i> PTFE-assisted plasma modification for nanofluidic applicationsQiushi Kang, Chenxi Wang, Kaimeng Liu, et al.
Micromachines|July 8, 2023
Research Progress of AlGaN-Based Deep Ultraviolet Light-Emitting DiodesRuiqiang Xu, Qiushi Kang, Youwei Zhang, et al.
Micromachines|May 27, 2023
Recent Advances on GaN-Based Micro-LEDsYouwei Zhang, Ruiqiang Xu, Qiushi Kang, et al.
ACS Applied Materials & Interfaces|August 28, 2024
InP/LiNbO<sub>3</sub> Covalent Heterointerface Construction via an Asymmetric Plasma Activation Strategy for Hybrid Integrated Quantum SystemsQiushi Kang, Han Yan, Fanfan Niu, et al.
ACS Applied Materials & Interfaces|July 28, 2021
Low-Temperature Co-hydroxylated Cu/SiO<sub>2</sub> Hybrid Bonding Strategy for a Memory-Centric Chip ArchitectureQiushi Kang, Chenxi Wang, Shicheng Zhou, et al.
ACS Applied Materials & Interfaces|February 5, 2026
Low-Temperature Ru-Ru Hybrid Bonding: Ar/H<sub>2</sub> Plasma and NH<sub>4</sub>OH Synergistic Activation for Ultrahigh Density InterconnectionYufei Bai, Jia Yang, Xinze Li, et al.
RSC Advances|May 11, 2022
Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz <i>via</i> VUV/O<sub>3</sub> activationJikai Xu, Chenxi Wang, Te Wang, et al.
Pageof 1

Showing results (1-10 of 7) with videos related to

Sort By:
Pageof 1
Lab on a Chip|May 22, 2023
Room-temperature bonding of glass chips <i>via</i> PTFE-assisted plasma modification for nanofluidic applicationsQiushi Kang, Chenxi Wang, Kaimeng Liu, et al.
Micromachines|July 8, 2023
Research Progress of AlGaN-Based Deep Ultraviolet Light-Emitting DiodesRuiqiang Xu, Qiushi Kang, Youwei Zhang, et al.
Micromachines|May 27, 2023
Recent Advances on GaN-Based Micro-LEDsYouwei Zhang, Ruiqiang Xu, Qiushi Kang, et al.
ACS Applied Materials & Interfaces|August 28, 2024
InP/LiNbO<sub>3</sub> Covalent Heterointerface Construction via an Asymmetric Plasma Activation Strategy for Hybrid Integrated Quantum SystemsQiushi Kang, Han Yan, Fanfan Niu, et al.
ACS Applied Materials & Interfaces|July 28, 2021
Low-Temperature Co-hydroxylated Cu/SiO<sub>2</sub> Hybrid Bonding Strategy for a Memory-Centric Chip ArchitectureQiushi Kang, Chenxi Wang, Shicheng Zhou, et al.
ACS Applied Materials & Interfaces|February 5, 2026
Low-Temperature Ru-Ru Hybrid Bonding: Ar/H<sub>2</sub> Plasma and NH<sub>4</sub>OH Synergistic Activation for Ultrahigh Density InterconnectionYufei Bai, Jia Yang, Xinze Li, et al.
RSC Advances|May 11, 2022
Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz <i>via</i> VUV/O<sub>3</sub> activationJikai Xu, Chenxi Wang, Te Wang, et al.
Pageof 1