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Polymers|June 10, 2023
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer MaterialsDavid Kalaš, Radek Soukup, Jan Řeboun, et al.
Polymers|November 13, 2021
FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected PolymersDavid Kalaš, Karel Šíma, Petr Kadlec, et al.
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