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Ruohe Yao

Showing results (1-10 of 5) with videos related to

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IEEE Transactions on Image Processing : a Publication of the IEEE Signal Processing Society|December 20, 2015
Contrast Enhancement by Nonlinear Diffusion FilteringZhetong Liang, Weijian Liu, Ruohe Yao
Small (Weinheim an Der Bergstrasse, Germany)|June 11, 2024
Synergistic Passivation on Buried Interface for Highly Efficient and Stable p-i-n Perovskite Solar CellsKai Wang, Bo Yu, Changqing Lin, et al.
Applied Optics|August 14, 2020
Improving the -3  dB bandwidth of micro-size LEDs through p-electrode patterns for visible light communicationLijun Tan, Kai Wang, Zijing Xie, et al.
Materials (Basel, Switzerland)|May 18, 2019
Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic TemperatureXing Fu, Yunfei En, Bin Zhou, et al.
Materials (Basel, Switzerland)|December 5, 2020
The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder JointsXing Fu, Min Liu, KeXin Xu, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
IEEE Transactions on Image Processing : a Publication of the IEEE Signal Processing Society|December 20, 2015
Contrast Enhancement by Nonlinear Diffusion FilteringZhetong Liang, Weijian Liu, Ruohe Yao
Small (Weinheim an Der Bergstrasse, Germany)|June 11, 2024
Synergistic Passivation on Buried Interface for Highly Efficient and Stable p-i-n Perovskite Solar CellsKai Wang, Bo Yu, Changqing Lin, et al.
Applied Optics|August 14, 2020
Improving the -3  dB bandwidth of micro-size LEDs through p-electrode patterns for visible light communicationLijun Tan, Kai Wang, Zijing Xie, et al.
Materials (Basel, Switzerland)|May 18, 2019
Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic TemperatureXing Fu, Yunfei En, Bin Zhou, et al.
Materials (Basel, Switzerland)|December 5, 2020
The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder JointsXing Fu, Min Liu, KeXin Xu, et al.
Pageof 1