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Scientific Reports|November 11, 2025
Comparative analysis of printed electronics technologies in RF and microwave circuitsSaeedeh Lotfi, Martin Janda, Jan Reboun, et al.
Materials (Basel, Switzerland)|December 11, 2022
Study of Internal Stress in Conductive and Dielectric Thick FilmsJiri Hlina, Jan Reboun, Martin Janda, et al.
Materials (Basel, Switzerland)|February 25, 2022
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed CopperJiri Hlina, Jan Reboun, Marek Simonovsky, et al.
Materials (Basel, Switzerland)|November 27, 2021
Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics ApplicationsJiri Hlina, Jan Reboun, Ales Hamacek
Environmental Science and Pollution Research International|September 22, 2016
The association between bisphenol A exposure and type-2 diabetes: a world systematic reviewMohammad H Sowlat, Saeedeh Lotfi, Masud Yunesian, et al.
Biotechnology Advances|March 8, 2022
Extracellular vesicles from phytobacteria: Properties, functions and usesMartin Janda, Silke Robatzek
Environmental Science and Pollution Research International|March 22, 2017
A systematic review on the efficiency of cerium-impregnated activated carbons for the removal of gas-phase, elemental mercury from flue gasMohammad Hossein Sowlat, Babak Kakavandi, Saeedeh Lotfi, et al.
The International Journal of Prosthodontics|October 11, 2024
Shear Bond Strength of Five Different Repair Systems to Three Different Ceramic MaterialsMartin Janda, Evaggelia Papia, Christel Larsson
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