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Advanced Science (Weinheim, Baden-Wurttemberg, Germany)|December 16, 2024
Ternary Logic Transistors Using Multi-Stacked 2D Electron Gas Channels in Ultrathin Oxide HeterostructuresJi Hyeon Choi, Tae Jun Seok, Sang June Kim, et al.
Romanian Journal of Morphology and Embryology = Revue Roumaine De Morphologie Et Embryologie|December 11, 2013
In vivo behavior of surface modified Ti6Al7Nb alloys used in selective laser melting for custom-made implants. A preliminary studyH Rotaru, G Armencea, Diana Spîrchez, et al.
ACS Applied Materials & Interfaces|July 26, 2019
Highly Uniform Resistive Switching Performances Using Two-Dimensional Electron Gas at a Thin-Film Heterostructure for Conductive Bridge Random Access MemorySung Min Kim, Hye Ju Kim, Hae Jun Jung, et al.
Advanced Materials (Deerfield Beach, Fla.)|May 28, 2014
Atomic layer deposited gallium oxide buffer layer enables 1.2 V open-circuit voltage in cuprous oxide solar cellsYun Seog Lee, Danny Chua, Riley E Brandt, et al.
ACS Applied Materials & Interfaces|December 1, 2017
Carbon Nanotubes as Etching Masks for the Formation of Polymer NanostructuresWoongbin Yim, Sae June Park, Sung Yong Han, et al.
Antioxidants (Basel, Switzerland)|September 28, 2023
Exploring the Potential of Olive Flounder Processing By-Products as a Source of Functional Ingredients for Muscle EnhancementJimin Hyun, Sang-In Kang, Sang-Woon Lee, et al.
Nanophotonics (Berlin, Germany)|December 5, 2024
Terahertz virus-sized gold nanogap sensorGangseon Ji, Hwan Sik Kim, Seong Ho Cha, et al.
ACS Nano|September 12, 2018
Field-Effect Device Using Quasi-Two-Dimensional Electron Gas in Mass-Producible Atomic-Layer-Deposited AlTae Jun Seok, Yuhang Liu, Hae Jun Jung, et al.
Food Research International (Ottawa, Ont.)|February 22, 2025
Valorization of fishery byproducts: Large-scale production of olive flounder functional protein ingredients and their effects on muscle regenerationJimin Hyun, R P G S K Amarasiri, Sang-Woon Lee, et al.
ACS Nano|February 12, 2025
Demonstration of NiCo as an Alternative Metal for Post-Cu InterconnectsJu Young Sung, Gi-Young Jo, Sang Mo Moon, et al.
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