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Scientific Reports|April 24, 2026
Thickness-dependent structural evolution of a-C:H layers formed by one-step Ar/CH<sub>4</sub> plasma reduction for direct Cu bondingHoogwan Lee, Sarah Eunkyung KimScientific Reports|December 11, 2020
Anti-oxidant copper layer by remote mode N<sub>2</sub> plasma for low temperature copper-copper bondingHaesung Park, Hankyeol Seo, Sarah Eunkyung KimJournal of Nanoscience and Nanotechnology|November 12, 2013
Fabrication of advanced bump layer for IC power deliveryKeonghwan Oh, Jun-Sung Ma, Sungdong Kim, et al.Micromachines|October 26, 2024
Analysis of Signal Transmission Efficiency in Semiconductor Interconnect and Proposal of Enhanced StructuresTae Yeong Hong, Sarah Eunkyung Kim, Jong Kyung Park, et al.Scientific Reports|March 21, 2024
Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layersMin Seong Jeong, Sang Woo Park, Yeon Ju Kim, et al.Pageof 1