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Materials (Basel, Switzerland)|July 27, 2024
Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted BondingSeonghui Han, Sang-Eun Han, Tae-Young Lee, et al.
Materials (Basel, Switzerland)|May 7, 2025
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)Sang-Eun Han, Dong-Gyu Choi, Seonghui Han, et al.
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