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Seung-Boo Jung

Showing results (11-20 of 34) with videos related to

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Journal of Nanoscience and Nanotechnology|May 15, 2015
Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimideBum-Geun Park, Kwang-Seok Kim, Kwang-Ho Jung, et al.
Journal of Nanoscience and Nanotechnology|August 2, 2012
Electrochemical migration characteristics of screen-printed silver patterns on FR-4 substrateKwang-Seok Kim, Jee-Hyuk Ahn, Bo-In Noh, et al.
Journal of Nanoscience and Nanotechnology|April 2, 2011
Flexibility of silver conductive circuits screen-printed on a polyimide substrateKwang-Seok Kim, Young-Chul Lee, Jong-Woong Kim, et al.
Journal of Nanoscience and Nanotechnology|May 15, 2015
Screen-printed Cu circuit for low-Cost fabrication and its electrochemical migration characteristicsKwang-Ho Jung, Kwang-Seok Kim, Bum-Geun Park, et al.
Materials Today. Bio|February 23, 2023
Electronic textiles: New age of wearable technology for healthcare and fitness solutionsJagan Singh Meena, Su Bin Choi, Seung-Boo Jung, et al.
Journal of Nanoscience and Nanotechnology|April 22, 2018
Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental ConditionsKyung-Yeol Kim, Woo-Ram Myung, Haksan Jeong, et al.
ACS Applied Materials & Interfaces|June 22, 2013
Enhanced electrical and mechanical properties of silver nanoplatelet-based conductive features direct printed on a flexible substrateYoung-In Lee, Seil Kim, Seung-Boo Jung, et al.
Journal of Nanoscience and Nanotechnology|April 22, 2018
Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend TestHaksan Jeong, Woo-Ram Myung, Yong-Gue Sung, et al.
Journal of Nanoscience and Nanotechnology|April 28, 2019
Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder JointsKyung Deuk Min, Woo-Ram Myung, Kyung-Yeol Kim, et al.
Journal of Nanoscience and Nanotechnology|November 20, 2013
Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistanceKwang-Seok Kim, Kwang-Ho Jung, Bum-Geun Park, et al.
Pageof 4

Showing results (11-20 of 34) with videos related to

Sort By:
Pageof 4
Journal of Nanoscience and Nanotechnology|May 15, 2015
Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimideBum-Geun Park, Kwang-Seok Kim, Kwang-Ho Jung, et al.
Journal of Nanoscience and Nanotechnology|August 2, 2012
Electrochemical migration characteristics of screen-printed silver patterns on FR-4 substrateKwang-Seok Kim, Jee-Hyuk Ahn, Bo-In Noh, et al.
Journal of Nanoscience and Nanotechnology|April 2, 2011
Flexibility of silver conductive circuits screen-printed on a polyimide substrateKwang-Seok Kim, Young-Chul Lee, Jong-Woong Kim, et al.
Journal of Nanoscience and Nanotechnology|May 15, 2015
Screen-printed Cu circuit for low-Cost fabrication and its electrochemical migration characteristicsKwang-Ho Jung, Kwang-Seok Kim, Bum-Geun Park, et al.
Materials Today. Bio|February 23, 2023
Electronic textiles: New age of wearable technology for healthcare and fitness solutionsJagan Singh Meena, Su Bin Choi, Seung-Boo Jung, et al.
Journal of Nanoscience and Nanotechnology|April 22, 2018
Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental ConditionsKyung-Yeol Kim, Woo-Ram Myung, Haksan Jeong, et al.
ACS Applied Materials & Interfaces|June 22, 2013
Enhanced electrical and mechanical properties of silver nanoplatelet-based conductive features direct printed on a flexible substrateYoung-In Lee, Seil Kim, Seung-Boo Jung, et al.
Journal of Nanoscience and Nanotechnology|April 22, 2018
Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend TestHaksan Jeong, Woo-Ram Myung, Yong-Gue Sung, et al.
Journal of Nanoscience and Nanotechnology|April 28, 2019
Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder JointsKyung Deuk Min, Woo-Ram Myung, Kyung-Yeol Kim, et al.
Journal of Nanoscience and Nanotechnology|November 20, 2013
Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistanceKwang-Seok Kim, Kwang-Ho Jung, Bum-Geun Park, et al.
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