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Micromachines|February 25, 2023
Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave ApplicationsSeung-Han Chung, Jae-Hyun Shin, Yong-Kweon Kim, et al.Micromachines|January 25, 2025
Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave ApplicationsSeung-Han Chung, Ho-Sun Yeom, Che-Heung Kim, et al.Microsystems & Nanoengineering|November 27, 2025
A three-dimensional bipolar microneedle electrode array with local ground integrated at each sidewall for enhanced focal electric stimulationSeung-Han Chung, Chaesung Kim, Minju Kim, et al.Pageof 1