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Sensors (Basel, Switzerland)
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May 21, 2020
Innovation Strategy Selection Facilitates High-Performance Flexible Piezoelectric Sensors
Shengshun Duan, Jun Wu, Jun Xia, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
March 31, 2026
Structured Multimaterial Fibers Enabling Intelligent Robots
Shengshun Duan, Xingbei Wang, Wenge Que, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
November 28, 2023
Insights into Materials, Physics, and Applications in Flexible and Wearable Acoustic Sensing Technology
Zhiwei Lin, Shengshun Duan, Mingyang Liu, et al.
ACS Nano
|
January 11, 2023
Water-Modulated Biomimetic Hyper-Attribute-Gel Electronic Skin for Robotics and Skin-Attachable Wearables
Shengshun Duan, Qiongfeng Shi, Jianlong Hong, et al.
Frontiers in Aging Neuroscience
|
December 6, 2021
Insights Into the Role of CSF1R in the Central Nervous System and Neurological Disorders
Banglian Hu, Shengshun Duan, Ziwei Wang, et al.
Research (Washington, D.C.)
|
June 5, 2023
Bioinspired Stretchable MXene Deformation-Insensitive Hydrogel Temperature Sensors for Plant and Skin Electronics
Jun Wu, Yinghui Li, Shengshun Duan, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
May 15, 2024
Venus Flytrap-Inspired Data-Center-Free Fast-Responsive Soft Robots Enabled by 2D Ni<sub>3</sub>(HITP)<sub>2</sub> MOF and Graphite
Shengshun Duan, Xiao Wei, Mingcen Weng, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|
September 7, 2023
Bioinspired Young's Modulus-Hierarchical E-Skin with Decoupling Multimodality and Neuromorphic Encoding Outputs to Biosystems
Shengshun Duan, Xiao Wei, Fangzhi Zhao, et al.
Science Advances
|
June 19, 2026
Highly conductive and ultrarobust elastic conductors for stretchable electronics
Tong Zheng, Shengxin Xiang, Qiongfeng Shi, et al.
Science Advances
|
November 29, 2024
Flexible mechano-optical dual-responsive perovskite molecular ferroelectric composites for advanced anticounterfeiting and encryption
Shengshun Duan, Pinzhen Chen, Yu-An Xiong, et al.
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Search research articles
Search
Showing results (1-10 of 18) with videos related to
Sort By:
Page
of 2
Sensors (Basel, Switzerland)
|
May 21, 2020
Innovation Strategy Selection Facilitates High-Performance Flexible Piezoelectric Sensors
Shengshun Duan, Jun Wu, Jun Xia, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
March 31, 2026
Structured Multimaterial Fibers Enabling Intelligent Robots
Shengshun Duan, Xingbei Wang, Wenge Que, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
November 28, 2023
Insights into Materials, Physics, and Applications in Flexible and Wearable Acoustic Sensing Technology
Zhiwei Lin, Shengshun Duan, Mingyang Liu, et al.
ACS Nano
|
January 11, 2023
Water-Modulated Biomimetic Hyper-Attribute-Gel Electronic Skin for Robotics and Skin-Attachable Wearables
Shengshun Duan, Qiongfeng Shi, Jianlong Hong, et al.
Frontiers in Aging Neuroscience
|
December 6, 2021
Insights Into the Role of CSF1R in the Central Nervous System and Neurological Disorders
Banglian Hu, Shengshun Duan, Ziwei Wang, et al.
Research (Washington, D.C.)
|
June 5, 2023
Bioinspired Stretchable MXene Deformation-Insensitive Hydrogel Temperature Sensors for Plant and Skin Electronics
Jun Wu, Yinghui Li, Shengshun Duan, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
May 15, 2024
Venus Flytrap-Inspired Data-Center-Free Fast-Responsive Soft Robots Enabled by 2D Ni<sub>3</sub>(HITP)<sub>2</sub> MOF and Graphite
Shengshun Duan, Xiao Wei, Mingcen Weng, et al.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|
September 7, 2023
Bioinspired Young's Modulus-Hierarchical E-Skin with Decoupling Multimodality and Neuromorphic Encoding Outputs to Biosystems
Shengshun Duan, Xiao Wei, Fangzhi Zhao, et al.
Science Advances
|
June 19, 2026
Highly conductive and ultrarobust elastic conductors for stretchable electronics
Tong Zheng, Shengxin Xiang, Qiongfeng Shi, et al.
Science Advances
|
November 29, 2024
Flexible mechano-optical dual-responsive perovskite molecular ferroelectric composites for advanced anticounterfeiting and encryption
Shengshun Duan, Pinzhen Chen, Yu-An Xiong, et al.
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