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Siliang He

Showing results (1-10 of 16) with videos related to

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Journal of Nanoscience and Nanotechnology|August 7, 2019
Effect of Zn Addition on Interfacial Reactions and Mechanical Properties Between Eutectic Sn58Bi Solder and ENIG SubstrateShiqi Zhou, Siliang He, Hiroshi Nishikawa
ACS Applied Materials & Interfaces|December 22, 2022
Process Engineered Spontaneous Orientation Polarization in Organic Light-Emitting DevicesSiliang He, Evgeny Pakhomenko, Russell J Holmes
Technology and Health Care : Official Journal of the European Society for Engineering and Medicine|September 28, 2015
Research on coupling relationship between ECG and PW signal in the cardiovascular systemFangfang Jiang, Shaoxiu Song, Jiabin Cheng, et al.
Nanomaterials (Basel, Switzerland)|February 26, 2026
A Transient Two-Phase Productivity Forecasting Method in Fractured Nanoporous Shale Gas ReservoirsRuihan Zhang, Siliang He, Qianwen Zhang, et al.
Scientific Reports|July 24, 2020
Author Correction: Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Scientific Reports|March 8, 2019
Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Materials (Basel, Switzerland)|March 25, 2022
Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver LayerPeijie Liang, Zhiliang Pan, Liang Tang, et al.
Materials (Basel, Switzerland)|January 28, 2026
Study on Microstructure and Properties of Micron Copper Powder-Liquid Metal Gallium Composite Interconnect JointBo Wang, Siliang He, Guopei Zhang, et al.
Materials (Basel, Switzerland)|March 13, 2024
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low TemperatureSiliang He, Jian Jiang, Yu-An Shen, et al.
ACS Applied Materials & Interfaces|October 16, 2020
Understanding the Role of Ion Migration in the Operation of Perovskite Light-Emitting Diodes by Transient MeasurementsQi Dong, Juliana Mendes, Lei Lei, et al.
Pageof 2

Showing results (1-10 of 16) with videos related to

Sort By:
Pageof 2
Journal of Nanoscience and Nanotechnology|August 7, 2019
Effect of Zn Addition on Interfacial Reactions and Mechanical Properties Between Eutectic Sn58Bi Solder and ENIG SubstrateShiqi Zhou, Siliang He, Hiroshi Nishikawa
ACS Applied Materials & Interfaces|December 22, 2022
Process Engineered Spontaneous Orientation Polarization in Organic Light-Emitting DevicesSiliang He, Evgeny Pakhomenko, Russell J Holmes
Technology and Health Care : Official Journal of the European Society for Engineering and Medicine|September 28, 2015
Research on coupling relationship between ECG and PW signal in the cardiovascular systemFangfang Jiang, Shaoxiu Song, Jiabin Cheng, et al.
Nanomaterials (Basel, Switzerland)|February 26, 2026
A Transient Two-Phase Productivity Forecasting Method in Fractured Nanoporous Shale Gas ReservoirsRuihan Zhang, Siliang He, Qianwen Zhang, et al.
Scientific Reports|July 24, 2020
Author Correction: Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Scientific Reports|March 8, 2019
Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Materials (Basel, Switzerland)|March 25, 2022
Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver LayerPeijie Liang, Zhiliang Pan, Liang Tang, et al.
Materials (Basel, Switzerland)|January 28, 2026
Study on Microstructure and Properties of Micron Copper Powder-Liquid Metal Gallium Composite Interconnect JointBo Wang, Siliang He, Guopei Zhang, et al.
Materials (Basel, Switzerland)|March 13, 2024
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low TemperatureSiliang He, Jian Jiang, Yu-An Shen, et al.
ACS Applied Materials & Interfaces|October 16, 2020
Understanding the Role of Ion Migration in the Operation of Perovskite Light-Emitting Diodes by Transient MeasurementsQi Dong, Juliana Mendes, Lei Lei, et al.
Pageof 2