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Microbial Biotechnology|July 2, 2024
Surface display of the COE antigen of porcine epidemic diarrhoea virus on Bacillus subtilis sporesYanhong Tian, Zhichao Wang, Ju Sun, et al.Materials (Basel, Switzerland)|June 12, 2026
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic PackagingPengrong Lin, Zirui Tong, Shimeng Xu, et al.The Science of the Total Environment|May 18, 2019
Exploring the spatiotemporal pattern of PM<sub>2.5</sub> distribution and its determinants in Chinese cities based on a multilevel analysis approachJianhua He, Su Ding, Dianfeng LiuEnvironmental Geochemistry and Health|January 7, 2021
Investigating the biophysical and socioeconomic determinants of China tropospheric O<sub>3</sub> pollution based on a multilevel analysis approachSu Ding, Jianhua He, Dianfeng LiuJournal of Chromatography. B, Analytical Technologies in the Biomedical and Life Sciences|July 13, 2019
Development of an online solid-phase extraction-liquid chromatography-mass spectrometric analysis of oxcarbazepine and its active metabolite licarbazepine from plasma with a direct injection stepLihua Qu, Lixuan Pan, Li Wang, et al.Micromachines|January 6, 2021
Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi<sub>9</sub> Microwire and Au MicrolayerHe Zhang, Shang Wang, Bingying Wu, et al.Materials (Basel, Switzerland)|June 27, 2025
Flexible Moisture-Electric Generator Based on Vertically Graded GO-rGO/Ag FilmsShujun Wang, Geng Li, Jiayue Wen, et al.ACS Applied Materials & Interfaces|July 28, 2021
Low-Temperature Co-hydroxylated Cu/SiO<sub>2</sub> Hybrid Bonding Strategy for a Memory-Centric Chip ArchitectureQiushi Kang, Chenxi Wang, Shicheng Zhou, et al.ACS Applied Materials & Interfaces|December 23, 2021
High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-<i>co</i>-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent ApplicationsHui Fang, Xiaoyun Qi, Shicheng Zhou, et al.Micromachines|November 15, 2018
Recent Progress in Rapid Sintering of Nanosilver for Electronics ApplicationsWei Liu, Rong An, Chunqing Wang, et al.Pageof 12