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ACS Applied Materials & Interfaces|January 31, 2022
Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration CircuitsTianzhuo Zhan, Keita Sahara, Haruki Takeuchi, et al.Micromachines|November 25, 2023
Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A ReviewTianzhuo Zhan, Mao Xu, Zhi Cao, et al.Pageof 2