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Angewandte Chemie (International Ed. in English)|March 22, 2023
Atroposelective Three-Component Coupling of Cyclic Diaryliodoniums and Sodium Cyanate Enabled by the Dual-Role of PhenolShan Yang, Tianze Zheng, Longhui Duan, et al.
Materials Horizons|October 18, 2022
Thermal and UV light adaptive polyurethane elastomers for photolithography-transfer printing of flexible circuitsJiaxin Shi, Zhiqi Wang, Tianze Zheng, et al.
Micromachines|December 31, 2025
Study on Stress Distribution and Its Impact on Reliability of SiO<sub>2</sub>-Based Inorganic Chiplet Gap FillingZiyang Ding, Shaowei Liu, Chen Lin, et al.
Nature Communications|April 22, 2025
The size of critical secondary nuclei of polymer crystals does not depend on supersaturationYang Liu, Zhiqi Wang, Yao Zhang, et al.
Materials Horizons|July 16, 2024
Filler effects inspired high performance polyurethane elastomer design: segment arrangement controlJiaxin Shi, Tianze Zheng, Zhiqi Wang, et al.
Polymers|May 11, 2019
Effects of Diisocyanate Structure and Disulfide Chain Extender on Hard Segmental Packing and Self-Healing Property of Polyurea ElastomersTing Li, Tianze Zheng, Jiarui Han, et al.
Materials (Basel, Switzerland)|December 31, 2025
Analysis of Post-Bonding Crack-Induced Double Cantilever Bending (PDC-DCB) Method for Hybrid Bonding Strength MeasurementCong Mei, Tianze Zheng, Qiuhan Hu, et al.
Micromachines|December 31, 2025
Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid BondingTianze Zheng, Yuan Xu, Cong Mei, et al.
Micromachines|May 27, 2026
A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film DielectricsCong Mei, Tianze Zheng, Ziyang Ding, et al.
Chemical Science|January 13, 2025
Data-driven parametrization of molecular mechanics force fields for expansive chemical space coverageTianze Zheng, Ailun Wang, Xu Han, et al.
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