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Materials (Basel, Switzerland)|December 9, 2023
Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic PackagingHsien-Chie Cheng, Wen-You JhuMicromachines|March 6, 2025
Dynamic Performance Evaluation of Bidirectional Bridgeless Interleaved Totem-Pole Power Factor Correction Boost ConverterHsien-Chie Cheng, Wen-You Jhu, Yu-Cheng Liu, et al.Scientific Reports|March 15, 2026
Effects of parasitic capacitance on switching transients and thermal performance in a single-phase SiC power MOSFET inverterHsien-Chie Cheng, Wen-You Jhu, Yan-Cheng Liu, et al.Pageof 1