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Xiaxia Cheng

Showing results (1-10 of 9) with videos related to

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Quantitative Imaging in Medicine and Surgery|September 2, 2025
Diagnosis of fetal laryngotracheal atresia combined with tracheoesophageal fistula via prenatal ultrasound: a case descriptionXuelu Feng, Pujuan Jia, Xiaxia Cheng, et al.
AME Case Reports|June 16, 2026
Prenatal ultrasound diagnosis of fetal cervicofacial lymphangioma: a case reportXiaxia Cheng, Xuelu Feng, Pujuan Jia, et al.
Quantitative Imaging in Medicine and Surgery|September 2, 2025
Prenatal ultrasound diagnosis of a rare diffuse placental chorioangioma with fetal edema: a case description and prognostic analysisPujuan Jia, Xuelu Feng, Xiaxia Cheng, et al.
Quantitative Imaging in Medicine and Surgery|September 2, 2025
Prenatal diagnosis of retrorenal left-sided inferior vena cava without hepatic segment using ultrasound and spatiotemporal image correlation: a rare case descriptionPujuan Jia, Yanzhao Wang, Minhong Zhang, et al.
Nano Letters|July 10, 2023
Can Adhesion Energy Optimize Interface Thermal Resistance at a Soft/Hard Material Interface?Xiaxia Cheng, Dongyi He, Man Zhou, et al.
Nano Letters|May 14, 2024
Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding InteractionXiangliang Zeng, Ting Liang, Xiaxia Cheng, et al.
Advanced Materials (Deerfield Beach, Fla.)|July 31, 2024
Soft, Tough, Antifatigue Fracture Elastomer Composites with Low Thermal Resistance through Synergistic Crack Pinning and Interfacial SlippageWeijian Wu, Jianfeng Fan, Chen Zeng, et al.
ACS Applied Materials & Interfaces|October 29, 2024
Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface MaterialsJiashuo Sheng, Zhian Zhang, Yunsong Pang, et al.
Physical Chemistry Chemical Physics : PCCP|January 19, 2024
Insight into the fracture energy dissipation mechanism in elastomer composites <i>via</i> sacrificial bonds and fillersDongyi He, Xiaxia Cheng, Chunyu Wong, et al.
Pageof 1

Showing results (1-10 of 9) with videos related to

Sort By:
Pageof 1
Quantitative Imaging in Medicine and Surgery|September 2, 2025
Diagnosis of fetal laryngotracheal atresia combined with tracheoesophageal fistula via prenatal ultrasound: a case descriptionXuelu Feng, Pujuan Jia, Xiaxia Cheng, et al.
AME Case Reports|June 16, 2026
Prenatal ultrasound diagnosis of fetal cervicofacial lymphangioma: a case reportXiaxia Cheng, Xuelu Feng, Pujuan Jia, et al.
Quantitative Imaging in Medicine and Surgery|September 2, 2025
Prenatal ultrasound diagnosis of a rare diffuse placental chorioangioma with fetal edema: a case description and prognostic analysisPujuan Jia, Xuelu Feng, Xiaxia Cheng, et al.
Quantitative Imaging in Medicine and Surgery|September 2, 2025
Prenatal diagnosis of retrorenal left-sided inferior vena cava without hepatic segment using ultrasound and spatiotemporal image correlation: a rare case descriptionPujuan Jia, Yanzhao Wang, Minhong Zhang, et al.
Nano Letters|July 10, 2023
Can Adhesion Energy Optimize Interface Thermal Resistance at a Soft/Hard Material Interface?Xiaxia Cheng, Dongyi He, Man Zhou, et al.
Nano Letters|May 14, 2024
Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding InteractionXiangliang Zeng, Ting Liang, Xiaxia Cheng, et al.
Advanced Materials (Deerfield Beach, Fla.)|July 31, 2024
Soft, Tough, Antifatigue Fracture Elastomer Composites with Low Thermal Resistance through Synergistic Crack Pinning and Interfacial SlippageWeijian Wu, Jianfeng Fan, Chen Zeng, et al.
ACS Applied Materials & Interfaces|October 29, 2024
Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface MaterialsJiashuo Sheng, Zhian Zhang, Yunsong Pang, et al.
Physical Chemistry Chemical Physics : PCCP|January 19, 2024
Insight into the fracture energy dissipation mechanism in elastomer composites <i>via</i> sacrificial bonds and fillersDongyi He, Xiaxia Cheng, Chunyu Wong, et al.
Pageof 1