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Journal of Nanoscience and Nanotechnology|March 3, 2021
Deformation Behavior of Various Interconnection Structures Using Fine Pitch Microelectromechanical Systems (MEMS) Vertical ProbeXuan Luc Le, Han Eul Lee, Sung-Hoon Choa
Micromachines|March 29, 2023
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted BondingXuan-Luc Le, Xuan-Bach Le, Yuhwan Hwangbo, et al.
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