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Materials (Basel, Switzerland)
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October 27, 2022
Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach
Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, et al.
Micromachines
|
August 26, 2023
Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach
Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, et al.
ACS Applied Materials & Interfaces
|
July 21, 2023
Morphological Diagram of Dynamic-Interfacial-Release-Induced Surface Instability
Yu-Fang Lai, Meng-Yuan Chang, Yan-Yu Liou, et al.
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of 1
Search research articles
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Showing results (1-10 of 3) with videos related to
Sort By:
Page
of 1
Materials (Basel, Switzerland)
|
October 27, 2022
Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach
Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, et al.
Micromachines
|
August 26, 2023
Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach
Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, et al.
ACS Applied Materials & Interfaces
|
July 21, 2023
Morphological Diagram of Dynamic-Interfacial-Release-Induced Surface Instability
Yu-Fang Lai, Meng-Yuan Chang, Yan-Yu Liou, et al.
Page
of 1