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Yazhou Feng

Showing results (1-10 of 5) with videos related to

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Materials (Basel, Switzerland)|August 12, 2023
Optimization of Cutting Parameters for Deep Hole Boring of Ti-6Al-4V Deep Bottle HoleWanzhong Li, Huan Zheng, Yazhou Feng
Materials (Basel, Switzerland)|August 28, 2025
Optimizing Gun Drilling Parameters for Oxygen-Free Copper Using Response Surface Methodology and Genetic AlgorithmXiaolan Han, Hailong Wang, Yazhou Feng, et al.
Materials (Basel, Switzerland)|June 24, 2022
Multiobjective Optimization of Cutting Parameters for TA10 Alloy Deep-Hole DrillingYazhou Feng, Huan Zheng, Xiaolan Han, et al.
Materials (Basel, Switzerland)|September 27, 2025
Optimization of Internal Chip Evacuation Cutting Tool System for Deep Bottle Holes Based on Chip Morphology ControlYazhou Feng, Zixiang Xu, Wanzhong Li, et al.
Applied and Environmental Microbiology|March 10, 2026
Coexistence process and driving factors of arbuscular mycorrhizal fungi in urban green soil under heavy metal stressHaopu Li, Yazhou Feng, Zhonghu Geng, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|August 12, 2023
Optimization of Cutting Parameters for Deep Hole Boring of Ti-6Al-4V Deep Bottle HoleWanzhong Li, Huan Zheng, Yazhou Feng
Materials (Basel, Switzerland)|August 28, 2025
Optimizing Gun Drilling Parameters for Oxygen-Free Copper Using Response Surface Methodology and Genetic AlgorithmXiaolan Han, Hailong Wang, Yazhou Feng, et al.
Materials (Basel, Switzerland)|June 24, 2022
Multiobjective Optimization of Cutting Parameters for TA10 Alloy Deep-Hole DrillingYazhou Feng, Huan Zheng, Xiaolan Han, et al.
Materials (Basel, Switzerland)|September 27, 2025
Optimization of Internal Chip Evacuation Cutting Tool System for Deep Bottle Holes Based on Chip Morphology ControlYazhou Feng, Zixiang Xu, Wanzhong Li, et al.
Applied and Environmental Microbiology|March 10, 2026
Coexistence process and driving factors of arbuscular mycorrhizal fungi in urban green soil under heavy metal stressHaopu Li, Yazhou Feng, Zhonghu Geng, et al.
Pageof 1