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Yeonju Go

Showing results (1-10 of 3) with videos related to

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Scientific Reports|February 19, 2026
Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientationJaeJun Yoon, TaekSoo Shin, DongJin Kim, et al.
Data in Brief|January 26, 2026
TPCpp-10M: Simulated proton-proton collisions in a time projection chamber for AI foundation modelsShuhang Li, Yi Huang, David Park, et al.
Patterns (New York, N.Y.)|April 24, 2026
Variable rate neural compression for sparse detector dataYi Huang, Yeonju Go, Jin Huang, et al.
Pageof 1

Showing results (1-10 of 3) with videos related to

Sort By:
Pageof 1
Scientific Reports|February 19, 2026
Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientationJaeJun Yoon, TaekSoo Shin, DongJin Kim, et al.
Data in Brief|January 26, 2026
TPCpp-10M: Simulated proton-proton collisions in a time projection chamber for AI foundation modelsShuhang Li, Yi Huang, David Park, et al.
Patterns (New York, N.Y.)|April 24, 2026
Variable rate neural compression for sparse detector dataYi Huang, Yeonju Go, Jin Huang, et al.
Pageof 1