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Scientific Reports
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February 19, 2026
Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientation
JaeJun Yoon, TaekSoo Shin, DongJin Kim, et al.
Data in Brief
|
January 26, 2026
TPCpp-10M: Simulated proton-proton collisions in a time projection chamber for AI foundation models
Shuhang Li, Yi Huang, David Park, et al.
Patterns (New York, N.Y.)
|
April 24, 2026
Variable rate neural compression for sparse detector data
Yi Huang, Yeonju Go, Jin Huang, et al.
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of 1
Search research articles
Search
Showing results (1-10 of 3) with videos related to
Sort By:
Page
of 1
Scientific Reports
|
February 19, 2026
Enhancing bonding strength of the electroplated Cu pillars for semiconductor package by controlling grain orientation
JaeJun Yoon, TaekSoo Shin, DongJin Kim, et al.
Data in Brief
|
January 26, 2026
TPCpp-10M: Simulated proton-proton collisions in a time projection chamber for AI foundation models
Shuhang Li, Yi Huang, David Park, et al.
Patterns (New York, N.Y.)
|
April 24, 2026
Variable rate neural compression for sparse detector data
Yi Huang, Yeonju Go, Jin Huang, et al.
Page
of 1