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Yibai Zhong

Showing results (1-10 of 6) with videos related to

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Science Advances|March 25, 2026
Pixelated electrically reconfigurable metasurfaces for intelligent thermal emission controlXiu Liu, Hyeonggyun Kim, Zexiao Wang, et al.
Nano Letters|August 7, 2025
Reconfigurable Integrated High-Speed Thermal Metamaterial Pixel ArraysYibai Zhong, Xiu Liu, Zexiao Wang, et al.
Nature|May 27, 2026
Metamaterial-enhanced near-field radiative heat transferZexiao Wang, Renwen Yu, Hakan Salihoglu, et al.
ACS Applied Materials & Interfaces|December 20, 2024
Physical Vapor Deposition of High-Mobility P-Type Tellurium and Its Applications for Gate-Tunable van der Waals PN PhotodiodesTianyi Huang, Sen Lin, Jingyi Zou, et al.
Nature Communications|February 15, 2025
Electrically programmable pixelated coherent mid-infrared thermal emissionXiu Liu, Yibai Zhong, Zexiao Wang, et al.
Nature Communications|January 17, 2025
Liquid-infused nanostructured composite as a high-performance thermal interface material for effective coolingRui Cheng, Qixian Wang, Zexiao Wang, et al.
Pageof 1

Showing results (1-10 of 6) with videos related to

Sort By:
Pageof 1
Science Advances|March 25, 2026
Pixelated electrically reconfigurable metasurfaces for intelligent thermal emission controlXiu Liu, Hyeonggyun Kim, Zexiao Wang, et al.
Nano Letters|August 7, 2025
Reconfigurable Integrated High-Speed Thermal Metamaterial Pixel ArraysYibai Zhong, Xiu Liu, Zexiao Wang, et al.
Nature|May 27, 2026
Metamaterial-enhanced near-field radiative heat transferZexiao Wang, Renwen Yu, Hakan Salihoglu, et al.
ACS Applied Materials & Interfaces|December 20, 2024
Physical Vapor Deposition of High-Mobility P-Type Tellurium and Its Applications for Gate-Tunable van der Waals PN PhotodiodesTianyi Huang, Sen Lin, Jingyi Zou, et al.
Nature Communications|February 15, 2025
Electrically programmable pixelated coherent mid-infrared thermal emissionXiu Liu, Yibai Zhong, Zexiao Wang, et al.
Nature Communications|January 17, 2025
Liquid-infused nanostructured composite as a high-performance thermal interface material for effective coolingRui Cheng, Qixian Wang, Zexiao Wang, et al.
Pageof 1