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Polymers|July 2, 2021
Mold Flow Analysis of Motor Core Gluing with Viscous Flow Channels and Dipping ModuleYong-Jie Zeng, Sheng-Jye Hwang, Yu-Da Liu, et al.Polymers|November 11, 2022
Simulation of Motor Core Gluing Process with Fine Mesh NetsYong-Jie Zeng, Chia-Wei Liang, Sheng-Jye Hwang, et al.Polymers|August 14, 2025
Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural SensitivityYu-Chi Sung, Chih-Ping Hu, Sheng-Jye Hwang, et al.Scientific Reports|January 3, 2026
Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent propertiesYu-Chi Sung, Chih-Ping Hu, Chun-Chieh Hung, et al.Pageof 1