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Yuan-Wei Chang

Showing results (1-10 of 6) with videos related to

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ACS Applied Materials & Interfaces|June 22, 2026
Wavelength-Tunable, Low-Angular Dispersion, and Narrowband Thermal Emitters by Incorporating Ge<sub>2</sub>Sb<sub>2</sub>Te<sub>5</sub> Layer into Grating-Assisted Multilayered StructuresYuan-Wei Chang, Po-Wei Ho, Hui-Hsin Hsiao
International Journal of Molecular Sciences|December 5, 2020
Healing Pattern Analysis for Dental Implants Using the Mechano-Regulatory Tissue Differentiation ModelMing-Jun Li, Pei-Ching Kung, Yuan-Wei Chang, et al.
Bioresource Technology|May 16, 2013
Comparison of high pressure and ambient pressure aerobic granulation sequential batch reactor processesYang-Min Liang, You-Lan Yang, Yuan-Wei Chang, et al.
Scientific Reports|April 14, 2018
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsYuan-Wei Chang, Chia-Chia Hu, Hsin-Ying Peng, et al.
Scientific Reports|December 22, 2017
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void FormationYuan-Wei Chang, Yin Cheng, Lukas Helfen, et al.
Scientific Reports|October 17, 2019
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium HeatingE-Wen Huang, Hung-Sheng Chou, K N Tu, et al.
Pageof 1

Showing results (1-10 of 6) with videos related to

Sort By:
Pageof 1
ACS Applied Materials & Interfaces|June 22, 2026
Wavelength-Tunable, Low-Angular Dispersion, and Narrowband Thermal Emitters by Incorporating Ge<sub>2</sub>Sb<sub>2</sub>Te<sub>5</sub> Layer into Grating-Assisted Multilayered StructuresYuan-Wei Chang, Po-Wei Ho, Hui-Hsin Hsiao
International Journal of Molecular Sciences|December 5, 2020
Healing Pattern Analysis for Dental Implants Using the Mechano-Regulatory Tissue Differentiation ModelMing-Jun Li, Pei-Ching Kung, Yuan-Wei Chang, et al.
Bioresource Technology|May 16, 2013
Comparison of high pressure and ambient pressure aerobic granulation sequential batch reactor processesYang-Min Liang, You-Lan Yang, Yuan-Wei Chang, et al.
Scientific Reports|April 14, 2018
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsYuan-Wei Chang, Chia-Chia Hu, Hsin-Ying Peng, et al.
Scientific Reports|December 22, 2017
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void FormationYuan-Wei Chang, Yin Cheng, Lukas Helfen, et al.
Scientific Reports|October 17, 2019
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium HeatingE-Wen Huang, Hung-Sheng Chou, K N Tu, et al.
Pageof 1