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Journal of Colloid and Interface Science|July 6, 2012
Adsorption behavior of plasmid DNA on binary self-assembled monolayers modified gold substratesWei-Lun Kao, Hsun-Yun Chang, Guo-Ji Yen, et al.
Colloids and Surfaces. B, Biointerfaces|February 8, 2016
Effect of surface potential on epithelial cell adhesion, proliferation and morphologyHsun-Yun Chang, Wei-Lun Kao, Yun-Wen You, et al.
ACS Applied Materials & Interfaces|August 22, 2017
Poly(3,4-ethylenedioxythiophene)-Based Nanofiber Mats as an Organic Bioelectronic Platform for Programming Multiple Capture/Release Cycles of Circulating Tumor CellsChia-Cheng Yu, Bo-Cheng Ho, Ruey-Shin Juang, et al.
The Analyst|March 23, 2016
Improvement of the gas cluster ion beam-(GCIB)-based molecular secondary ion mass spectroscopy (SIMS) depth profile with O2(+) cosputteringYi-Hsuan Chu, Hua-Yang Liao, Kang-Yi Lin, et al.
The Analyst|April 11, 2019
Effect of energy per atom (E/n) on the Ar gas cluster ion beam (Ar-GCIB) and O2+ cosputter processShin-Kung Wang, Hsun-Yun Chang, Yi-Hsuan Chu, et al.
Journal of Nanobiotechnology|February 21, 2019
Random and aligned electrospun PLGA nanofibers embedded in microfluidic chips for cancer cell isolation and integration with air foam technology for cell releaseChia-Cheng Yu, Yi-Wen Chen, Po-Ying Yeh, et al.
Langmuir : the ACS Journal of Surfaces and Colloids|August 12, 2014
Effect of surface potential on extracellular matrix protein adsorptionJiun-Hao Lin, Hsun-Yun Chang, Wei-Lun Kao, et al.
Rapid Communications in Mass Spectrometry : RCM|September 14, 2011
Molecular dynamic-secondary ion mass spectrometry (D-SIMS) ionized by co-sputtering with C60+ and Ar+Yun-Wen You, Hsun-Yun Chang, Wei-Chun Lin, et al.
The Analyst|December 15, 2010
The role of the auxiliary atomic ion beam in C60(+)-Ar+ co-sputteringWei-Chun Lin, Chi-Ping Liu, Che-Hung Kuo, et al.
ACS Nano|April 30, 2010
Effect of fabrication parameters on three-dimensional nanostructures and device efficiency of polymer light-emitting diodesBang-Ying Yu, Chia-Yi Liu, Wei-Chun Lin, et al.
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